The covalent bond compound of aluminum nitride is. This atomic crystal is known as a diamond-like Nitride, Hexagonal System, or wurtzite crystal structure. It’s a white-colored powder. AlN is the chemical formula.

What Is Aluminum Nitride (or )?

aluminum Nitride, a material that is well known for its electrical insulating and thermal conductivity properties, makes excellent semiconductor material. You can use it as a heatsink in light-emitter technology.

Aluminum nitride, an inorganic compound containing aluminium and nitrogen is known as. It can be found in the wurtzite crystal and has a 6 eV band gap at room temperature. This allows it to be used in ultraviolet optoelectronics. Also, it is used as a semiconductor circuit carrier.

Aluminum Nitride, a technical ceramic material with dense structure, can be produced in thin and thick forms. The carbothermic reduction method is used to make it. This can prove costly so you should research a more economical powder preparation method. Many sintering agents are used to ensure that the material is dense enough to comply with technical specifications.

Aluminum Nitride can also be used to produce optical materials like nanotubes which are used as chemical sensors. You can use it as a substrate for silicon processing. It’s highly resistant to corrosion and oxidation. It can withstand high temperatures in an inert atmosphere.

Aluminium nitride can be found in virtually any metal. It comes in a grayish-blue to white powder. It dissolves easily in water and minerals acids. But, hydrogen atmospheres can make it unstable. It’s also very flammable.

It forms the radio frequency filters in mobile phones. It can also be used in robotics and medical imaging. You can also use its piezoelectric property in bulk thin-film acoustic resonanceators.

Aluminum Nitride History:

AlN aluminium nitride first synthesized back in 1877. AlN aluminum was first synthesized back in 1877. Unlike beryllium oxide, AlN aluminum nitride is non-toxic. AlN aluminiu nitride can replace beryllium oxide and alumina in many electronic devices.

Aluminum nitride may be made from the reduction of aluminum oxide or carbon. Or by directly nitriding aluminium metal. AlN Aluminium nitride, a compound connected by covalent bonding is called. This material has a hexagonal crystal structure, which is identical to zinc sulfide’s and fiber zinc oxide’s. In high temperature environments, the substance remains stable. When the ambient temperature exceeds 700F, there will be oxidation on the substance’s surfaces. The surface can still be seen with 5-10 nm thickness oxide films at room temperature. Protective oxide films are still possible for substances up to 1370.

Aluminum Nitride Properties:

AlN aluminum is excellent for resisting thermal shock. It has good thermal conductivity as well as a very low thermal expansion coefficient. An ideal crucible for melting pure aluminum, aluminium, and alloys is AlN aluminum Nitride due to its resistance against molten metallic corrosion. AlN aluminum is also an electric insulator that has excellent dielectric properties. It is promising for use as an electrical component.

It can be protected from ionization during annealing by applying a aluminum-nitride layer to the gallium arsenide surface. AlN aluminum is used to catalyze the transformation of hexagonal and cubic boron nutrides. At room temperature aluminum nitride reacts slow with water. You can make it from aluminum powder in an atmosphere of ammonia and nitrogen at 800-1000. This product can be found in white or gray-blue powder.

Tongrun produces with high purity, fine particles, uniform distribution, high specific surface, high bulk density, high injection molding capabilities, excellent dispersibility, and good quality aluminum nitride . Excellent compatibility with semiconductor silica, excellent interface compatibility and the ability to improve mechanical, thermal conductivity, dielectric and electrical properties of composite materials.

Aluminum Nitride Uses:

Useful for making thermal pastes and greases with high-temperature conductive filler

Highly thermallyconductive fillers, for use in thermally-conductive adhesives, silicon wafers with thermal conductivity, and epoxy thermallyconductive potting compound;

Thermally conductive filler for thermoplastics

For packaging materials, adhesives for high temperatures, heat-dissipating lubricants and heat-dissipating inks, use thermally conductive filler

Thermally conductive insulation for the production of highly thermally conductive integrated Circuit Substrates (MCPCB and FCCL).

Thermally-conductive filler to thermal interface materials. (TIM)

This is for the crucible-metal smelting process, including evaporation, ceramic, and cutting tools.

It is useful for the production of ceramic substrates high in thermal conductivity aluminum-nitride and other products.

Use the conductive ceramic boat for evaporation

It is used for the production of high-quality LED phosphors.

Ceramic properties of AlN:

An aluminum nitride clay is ceramic with a main crystal phase of ALN aluminum nitride. It has excellent mechanical properties and can be sintered at normal pressure. Excellent electrical properties include dielectric constant, dielectric losses, bulk resistance, dielectric strength, and light transmission.

1. AlN aluminum-nitride powder features high purity, low particle sizes, and very high activity. It’s the raw material used to make aluminum nitride ceramic sheets with high thermal conductivity.

2. This ceramic aluminum nitride substrate exhibits high thermal conductivity. The ideal substrate and packaging material for large-scale integrated Circuit Heat Sinks.

3. AlN aluminum-nitride is hardier than traditional alumina. It’s a brand new ceramic material that resists wear. Due to its cost, however, it cannot be used in areas that are very worn.

4. This ceramic has heat resistance and melt erosion resistant and thermal shock resistivity. It can also be used to produce Al vaporizers. Infrared windows can also be made from its optical property. Aluminum nitride can also be used as a high frequency piezoelectric element or ultra-large scale integrated circuit substrates.

5. AlN aluminum is resistant to heat, and it can resist the melting of molten iron. AlN is resistant to acids and easily dissolves in alkaline solution. If exposed to humid atmosphere, the new AlN surface can form a thin oxide layer. It can also be used to make crucibles and firing molds for the melting of metals like aluminum, silver and lead. AlN ceramics can replace harmful beryllium oxide ceramics by having better metallization characteristics.

Al2O3 or BeO ceramics were the main substrate materials for high power packaging for many years. Both of these substrate materials come with inherent drawbacks. Low thermal conductivity, and low thermal expansion coefficient of Al2O3, make it a poor choice for chip materials. BeO, despite its excellent comprehensive properties and high cost of production, is toxic.

Therefore, these substrate materials cannot be considered the optimal material to develop high-power LED devices. The aluminum nitride ceramics possess excellent properties like high strength and high thermal conductivity. They are set to replace the traditional high-power LED substrate material and will be the next most important ceramic substrate material.

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Mis-asia (Advanced Material Tech Co., Ltd.) is a professional Aluminium nitride / powder manufacturer. We have over 12 years’ experience in chemical products development and research. For high-quality Tungsten carbide, contact us .