What is Copper Oxide?
There are two stable copper oxides, copper(II) oxide (CuO) and copper(I) oxide (Cu2O). Copper(I) oxide or cuprous oxide (Cu2O) is an oxide of copper. It is insoluble in water and organic solvents. Copper(I) oxide dissolves in concentrated ammonia solution to form the colorless complex [Cu(NH3)2]+, which readily oxidizes in air to the blue [Cu(NH3)4(H2O)2]2+. It dissolves in hydrochloric acid to form HCuCl2 (a complex of CuCl), while dilute sulfuric acid and nitric acid produce copper(II) sulfate and copper(II) nitrate, respectively. Copper(I) oxide is the mineral cuprite in some red-colored rocks. When exposed to oxygen, copper will naturally oxidize to copper(I) oxide, but this takes ample time. The artificial formation is usually accomplished at high temperatures or high oxygen pressure. With further heating, copper(I) oxide will form copper(II) oxide.
Formation of copper oxide
Formation of copper(I) oxide is the basis of Fehling's test and Benedict's test for reducing sugars which reduce an alkaline solution of a copper(II) salt and give a precipitate of Cu2O. Cuprous oxide forms on silver-plated copper parts exposed to moisture when the silver layer is porous or damaged; this corrosion is known as red plague. Copper(II) oxide or cupric oxide (CuO) is the higher oxide of copper. As a mineral, it is known as tenorite.
A Novel Method of Etching Copper Oxide Using Acetic Acid
The removal of copper oxide using acetic acid at low temperatures was investigated. Acetic acid removes various copper oxides, including cuprous, cupric, and cupric hydroxide, without attacking the underlying copper film. The removal of these oxides was determined by X-ray photoelectron spectroscopy. Acetic acid can tolerate up to 4 vol % water dilution without hindering the oxide removal while producing an oxide-free surface. However, if a deionized water rinse is performed after an acetic acid treatment, a surface film of cupric hydroxide forms immediately. An acetic acid treatment at 35°C without a water rinse removes the native copper oxide and produces an oxide-free, streak-free copper surface. © 2001 The Electrochemical Society. All rights reserved.
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